MAE A - Z Index |
Dr. Viswanadham Puligandla
Adjunct Lecturer
Education: Ph.D., Chemistry, University of Toledo (1974) ~ M.Sc.,
Chemistry, Saugor University, India (1959)
Areas of Expertise:Electronic Packaging, Reliability Engineering, Materials Science,
Failure Analysis, Lead-Free Interconnection Alloys, High Temperature
Chemical Thermodynamics and Phase Equilibria,
Background: Dr. Puligandla Viswanadham has well over a quarter century electronic
packaging research experience in such areas as Advanced Packaging,
Advanced laminate technology, Reliability Engineering, Failure
Analysis, and Lead-Free Interconnect materials. His industrial
experience includes Research and Development at International Business
and or graduate teaching AES Higher Secondary School, University
of Toledo, Ohio Donincan College, and University of Texas at Arlington.
He has authored or co-authored over 125 publications in the areas
of High Temperature Inorganic Chemistry, Analytical Chemistry,
Microelectronics Packaging, and Reliability. He co-authored a book
on Failure Modes and Mechanisms in Electronic Packages published
by Chapman and Hall.
He has seven patents and 15 invention disclosures to his credit.
He received the Third IBM Invention Achievement Award, an Excellence
Award, and a Fourth Level Author Recognition Award.
E-mail: viswam38@tx.rr.com
viswam@uta.edu
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