MAE A - Z Index

Dereje Agonafer, Ph.D.
Professor

Education: Ph.D. Howard University, 1984

Areas of Expertise: Electronic packaging, heat transfer, thermal engineering.

Background: Dr. Agonafer has 15 years experience at IBM, the majority of which were in the development of Computer Aided Thermal Engineering (CATE). He is a Fellow of the American Society of Mechanical Engineers International. He has taught over 70 short courses focusing on the application of finite element techniques to electronic packaging, the application of finite control volume techniques to electronic packaging and computer aided thermal engineering.

Email: agonafer@uta.edu

Website: Electronic, MEMS & Nanoelectronic Systems Packaging Center

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